IPC 4101
Lead Free Delamination
Tired of Printed Circuit Board Delamination?
IPC 4101/99 and /124 are the Answer
For some time now the Industry has had to deal with delamination in its Lead Free Boards as it waited for a solution, which would ideally get back to processing the way we did when everything was SnPb. Delamination has occurred primarily on boards made from phenolic laminates, which are used for lead-free and high temp PCBs. While these materials have great thermal properties (Tg > 170C° and Td > 340C°, and conforming to IPC 4101/126/129), they are extremely weak in the fundamental areas of moisture absorption and copper to laminate adhesion.
Moisture Absorption
Standard 130Tg FR4 materials typically have a moisture absorption rate of 0.20% when measured using a 0.028" core material. Phenolic materials often measure moisture absorption of up to 0.45% when measured using the same test vehicle.
Copper to Laminate Adhesion
Standard 130Tg FR4 materials generate peel strength results of 6-9 lbs. Holding all parameters equal, phenolic materials generate peel strength results of 3-4 lbs.
Vapor Escape
These material characteristics take on much more value when you consider the effects of lead-free assembly parameters. Any moisture trapped or absorbed into the PCB will escape during assembly in the form of water vapor, the force of which is measured in psi (pounds per square inch). The vapor will escape from the dielectric from the weakest point in the board, which is typically plated via holes. During standard SnPb assembly at 200C, the vapor pressure is 225 psi. At Pb-Free assembly temperatures (250C), however, the vapor pressure increases to 575 psi.
The Perfect Storm
Combining the increased vapor pressure with phenolic material characteristics of increased moisture absorption and lower adhesion strength gives you a perfect storm capable of ruining entire production runs. In fact, the forces here are so strong that often instead of just blowing vias, entire layers can separate from each other forming delamination areas of 1 square inch or greater.
The Saturn Solution
Our solution is move towards non-phenolic materials, many of which can be found under IPC 4101/99 and /124. To qualify under these IPC categories for lead-free materials, they must have 150Tg and 325Td. While the thermal properties are not as high as the /126 or /129 materials, the mechanical characteristics more than make up for this, as demonstrated by lab tests we commissioned on standard test vehicles.
For more detailed information, please view our webinar we had on this topic at http://www.saturnelectronics.com/webinar_leadfree.htm.
Other Modes/Issues that this improvement will address:
Processing Lead Times
Drill Quality
Total Cost of Ownership
Thursday, November 13, 2008
Sunday, November 9, 2008
Cavity Boards
Cavity Boards
Cavity boards are multilayer designs that expose inner layers to air by requiring pockets of material to be cut out. This requires laminating precut materials, controlled-depth fabrication, tight processing controls, and manufacturing versatility. Also, our standardized Multi-Line tooling systems have been critical in the processing of cavity boards.
Industries Served
Military
RF/Microwave
Automotive - Close Proximity Radar
The exciting part of the Printed Circuit Board fabrication business is the integration and application of various fabrication processes for the manufacture of high technology, exotic, and other non-standard products. Cavity Boards are just one of the many examples Saturn Electronics Corp. offers its customers.
For examples of specific boards offered by Saturn, please follow this link: Examples of Current Technology Applications
Cavity boards are multilayer designs that expose inner layers to air by requiring pockets of material to be cut out. This requires laminating precut materials, controlled-depth fabrication, tight processing controls, and manufacturing versatility. Also, our standardized Multi-Line tooling systems have been critical in the processing of cavity boards.
Industries Served
Military
RF/Microwave
Automotive - Close Proximity Radar
The exciting part of the Printed Circuit Board fabrication business is the integration and application of various fabrication processes for the manufacture of high technology, exotic, and other non-standard products. Cavity Boards are just one of the many examples Saturn Electronics Corp. offers its customers.
For examples of specific boards offered by Saturn, please follow this link: Examples of Current Technology Applications
Lead Free HASL
Lead Free HASL
Lead Free HASL
Definition
SN100CL-
SnCu alloy stabilized with Ni, composed of:
99.3% Tin
<0.7%>
Industry Misconceptions
Predictions of HASL’s Demise
Solderability Issues
Short Duration of Usage
Benefits of Pb-HASL
Lower Copper Erosion on PCB surface and vias
Definition
SN100CL-
SnCu alloy stabilized with Ni, composed of:
99.3% Tin
<0.7%>
Industry Misconceptions
Predictions of HASL’s Demise
Solderability Issues
Short Duration of Usage
Benefits of Pb-HASL
Lower Copper Erosion on PCB surface and vias
Quick Process
Long Shelf Life
Cost
Forgiving
a.) Humidity
b.) Handling
c.) Temperature
Solder Joint Strength
Thickness Criteria
•Generic Thickness Requirement
•Not proper to have only one
-Smaller Pads receive thicker solder deposition
•Solution
• Minimum Alloy Thickness should be segregated by Ranges of Pad Size
Forgiving
a.) Humidity
b.) Handling
c.) Temperature
Solder Joint Strength
Thickness Criteria
•Generic Thickness Requirement
•Not proper to have only one
-Smaller Pads receive thicker solder deposition
•Solution
• Minimum Alloy Thickness should be segregated by Ranges of Pad Size
•Specific Design Set-Up
–Each Design may require its own specific set-up
–Adjustments
•Air Knife Pressure
•Retract Speed
•Dwell Time
–Each Design may require its own specific set-up
–Adjustments
•Air Knife Pressure
•Retract Speed
•Dwell Time
Implementation
•Alloy Control
•Lower copper content of alloy increases solderability
•Standard Drossing of solder pot is not enough to keep copper content below 0.90%
•Recommend a 1/4 - 1/3 solder pot dump once weekly measurement reaches 0.90%
•Alloy Control
•Lower copper content of alloy increases solderability
•Standard Drossing of solder pot is not enough to keep copper content below 0.90%
•Recommend a 1/4 - 1/3 solder pot dump once weekly measurement reaches 0.90%
SN100CL Study Conclusion
•No Solderability Issues at any customer
–Fab Notes
•Fab notes can specify the use of these coupons or range of solder thickness standards
–Forcing your supplier to meet these specs will give you:
»Control over the Process
–Fab Notes
•Fab notes can specify the use of these coupons or range of solder thickness standards
–Forcing your supplier to meet these specs will give you:
»Control over the Process
•By implementing these proposed solutions, you can:
–Save up to 30% of your bare board cost
–Increase performance of your products
–Standardize your fab notes to remove risk of non-performing products
–Improve your supply base
–Save up to 30% of your bare board cost
–Increase performance of your products
–Standardize your fab notes to remove risk of non-performing products
–Improve your supply base
For more information on Lead Free Finishes please click here to read more:
PTFE / Hybrid Technologies for PCBs
PTFE / Hybrid Technologies
PTFE / Hybrid Technologies supplier Saturn Electronics Corporation, bare board manufacturer, revved up production of their Advanced Technologies with the addition of the March plasma treatment system allows us to offer our customers PTFE ( or Teflon) based products. These are commonly used in designs with signal integrity concerns. Standard PCB fabricators cannot offer these materials easily due to the plasma treatment these materials typically require. In order to plate this material effectively, the surface must first be activated. We have in-house capability and materials inventory that enables us to best serve our customers. We have also developed the proper laminate recipes that are required to produce hybrid boards using PTFE-based and FR-4 materials together in one design.
Industries served include:
RF/Microwave
Aerospace
Military
Automotive - Close Proximity Radar
The exciting part of the Printed Circuit Board fabrication business is the integration and application of various fabrication processes for the manufacture of high technology, exotic, and other non-standard products. Fine Line and Spacing is just one of the many examples Saturn Electronics Corp. offers its customers.
For examples of specific boards offered by Saturn, please follow this link:
Examples of Current Technology Applications
PTFE / Hybrid Technologies supplier Saturn Electronics Corporation, bare board manufacturer, revved up production of their Advanced Technologies with the addition of the March plasma treatment system allows us to offer our customers PTFE ( or Teflon) based products. These are commonly used in designs with signal integrity concerns. Standard PCB fabricators cannot offer these materials easily due to the plasma treatment these materials typically require. In order to plate this material effectively, the surface must first be activated. We have in-house capability and materials inventory that enables us to best serve our customers. We have also developed the proper laminate recipes that are required to produce hybrid boards using PTFE-based and FR-4 materials together in one design.
Industries served include:
RF/Microwave
Aerospace
Military
Automotive - Close Proximity Radar
The exciting part of the Printed Circuit Board fabrication business is the integration and application of various fabrication processes for the manufacture of high technology, exotic, and other non-standard products. Fine Line and Spacing is just one of the many examples Saturn Electronics Corp. offers its customers.
For examples of specific boards offered by Saturn, please follow this link:
Examples of Current Technology Applications
Controlled Impedance Designs PCBs
Controlled Impedance Designs
Saturn engineers have access to impedance design and stackup software that enables us to verify your line widths, spacing, and stackup prior to CAM.
Based on the proximity of your design to your calculations, we can make adjustments to the design or adjust the stackup to best model the desired impedance. After fabrication, we verify our calculations by performing impedance testing using our Polar CITS500s Controlled Impedance Test System.
The exciting part of the Printed Circuit Board fabrication business is the integration and application of various fabrication processes for the manufacture of high technology, exotic, and other non-standard products. Fine Line and Spacing is just one of the many examples Saturn Electronics Corp. offers its customers.
For examples of specific boards offered by Saturn, please follow this link:
Examples of Current Technology Applications
Fine Line and Spacing PCBs
Fine Line and Spacing PCB supplier Saturn Electronics Corporation, bare board manufacturer, have invested over $200,000 in software, analysis tools, R&D, and equipment to develop systems for fine line and spacing products.
The exciting part of the Printed Circuit Board fabrication business is the integration and application of various fabrication processes for the manufacture of high technology, exotic, and other non-standard products. Fine Line and Spacing is just one of the many examples Saturn Electronics Corp. offers its customers.
The current Fine Line and Spacing system addresses layer-to-layer registration issues by customizing material scale factors for each specific design. Also, we use a cupric etching system, which is essential for creating fine lines on inner layers. As a result, we are currently processing 3 mil line / spacing in prototype quantities (4 mils in production) and have built boards with layer counts in excess of 20 layers.
For examples of specific boards offered by Saturn, please follow this link:
Examples of Current Technology Applications
Thursday, November 6, 2008
Hipot Testing for Heavy Copper PCBs
Heavy Copper Core PCB Hipot Testing
Hipot is an abbreviation for high potential and is used in the testing instruments used to justify electrical insulation in heavy copper printed circuit boards.
Heavy Copper PCB History
At one point in recent history, Saturn Electronics Corporation, a PCB Manufacturing firm, was one of North America's largest users of heavy copper laminate, which we used in the production of power distribution boards for the automotive industry.
Diversifying Core Products
Retaining our skill set in bare board hipot testing and precision etching heavy copper, we applied it to Power Supply. In addition, we applied our registration system to address concerns such as layer to layer winding registration, dry resin, and etch factors commonly seen by users of Heavy Copper PWB Multilayer boards.
PWB Capabilities at a Glance
Heavy Copper PCB Capabilities
We commonly produce boards with 2, 3, 4, & 6 ounce copper with up to 20 layers.
Thermal Management
Additionally, Saturn expertise in Thermal Management for Heavy Copper PCBs leads the Printed Circuit Board industry.
Hipot Testing for PCB Manufacturing
Saturn Electronics Corp. is an industry leader in Hipot Testing for PCB Manufacturing.
Industries Served
Automotive, Medical, Aerospace, Military
Hi-Pot Testing for Heavy Copper PCBs
Hipot is an abbreviation for high potential and is used in the testing instruments used to justify electrical insulation in heavy copper printed circuit boards.
Heavy Copper PCB History
At one point in recent history, Saturn Electronics Corporation, a PCB Manufacturing firm, was one of North America's largest users of heavy copper laminate, which we used in the production of power distribution boards for the automotive industry.
Diversifying Core Products
Retaining our skill set in bare board hipot testing and precision etching heavy copper, we applied it to Power Supply. In addition, we applied our registration system to address concerns such as layer to layer winding registration, dry resin, and etch factors commonly seen by users of Heavy Copper PWB Multilayer boards.
PWB Capabilities at a Glance
Heavy Copper PCB Capabilities
We commonly produce boards with 2, 3, 4, & 6 ounce copper with up to 20 layers.
Thermal Management
Additionally, Saturn expertise in Thermal Management for Heavy Copper PCBs leads the Printed Circuit Board industry.
Hipot Testing for PCB Manufacturing
Saturn Electronics Corp. is an industry leader in Hipot Testing for PCB Manufacturing.
Industries Served
Automotive, Medical, Aerospace, Military
Hi-Pot Testing for Heavy Copper PCBs
Tuesday, November 4, 2008
New Mania Micronic 86 Drilling Machine
New Mania Micronic 86 Drilling Machine
Saturn Electronics Corporation, bare board manufacturer, recently installed the Mania Micronic 86 Drilling Machine into their Romulus, Mi facility.
Six-Spindle PCB-drilling high precision machine
Linear x, y, & Z axis motors 2400 inches per minute table speed
220k RPM Spindle Speed
Drilling of structures with resolutions and density down to +/- 1 mil e.g. for BGA, Flip-Chip Technology and all state of the art materials and structures
Holes diameter range starting from 4 mils
Depth structuring for highly accurate blind via drilling down to +/- 0.5 mil by unique Contact-Drilling feature (CBD)
Options for PCB contour routing or drilling/routing
Free 24-layer PCB Keychain
Saturn Electronics Corporation, bare board manufacturer, recently installed the Mania Micronic 86 Drilling Machine into their Romulus, Mi facility.
Six-Spindle PCB-drilling high precision machine
Linear x, y, & Z axis motors 2400 inches per minute table speed
220k RPM Spindle Speed
Drilling of structures with resolutions and density down to +/- 1 mil e.g. for BGA, Flip-Chip Technology and all state of the art materials and structures
Holes diameter range starting from 4 mils
Depth structuring for highly accurate blind via drilling down to +/- 0.5 mil by unique Contact-Drilling feature (CBD)
Options for PCB contour routing or drilling/routing
Free 24-layer PCB Keychain
Heavy Copper PCBs
Heavy Copper PCBs
Saturn Electronics Corporation Heavy Copper Multilayer Bare Board Manufacturing
At one point in recent history, Saturn Electronics Corporation, bare board manufacturer, was one of North America's largest users of heavy copper laminate, which we used in the production of power distribution boards for the automotive industry. We retained our skill set in precision etching heavy copper and applied it to other industries, namely the power supply industry. Furthermore, we applied our registration system to address concerns such as layer to layer winding registration, dry resin, and etch factors commonly seen by users of heavy copper multilayer boards. We commonly produce boards with 2, 3, 4, & 6 ounce copper with up to 20 layers.
Industries Served
Automotive
Medical
Aerospace
Military
To see more boards offered by Saturn Electronics Corp., please click here to read more.
http://saturnelectronics.com/heavycopperpcb.htm
Saturn Electronics Corporation Heavy Copper Multilayer Bare Board Manufacturing
At one point in recent history, Saturn Electronics Corporation, bare board manufacturer, was one of North America's largest users of heavy copper laminate, which we used in the production of power distribution boards for the automotive industry. We retained our skill set in precision etching heavy copper and applied it to other industries, namely the power supply industry. Furthermore, we applied our registration system to address concerns such as layer to layer winding registration, dry resin, and etch factors commonly seen by users of heavy copper multilayer boards. We commonly produce boards with 2, 3, 4, & 6 ounce copper with up to 20 layers.
Industries Served
Automotive
Medical
Aerospace
Military
To see more boards offered by Saturn Electronics Corp., please click here to read more.
http://saturnelectronics.com/heavycopperpcb.htm
IPC 4101/99/124 and SN100CL – Lead Free HASL
Saturn Shines at PCB West
Bare Board Manufacturer Shows PCB Designers how to Control the Process
Saturn Electronics Corporation, a Bare Board Manufacturer, took its Lead Free Cost Reduction presentation to Santa Clara, CA for the PCB West 2008 from September 14-18. Yash Sutariya delivered the presentation, which claims that utilizing the right combination of materials, finishes, and solders through the IPC 4101/99/124 and SN100CL – Lead Free HASL can produce notable benefits, such as cutting the costs on lead free boards by up to 30% and increasing PCB reliability at the same time.
A crowd approaching close to 40 listened in as Sutariya advanced what he felt were the main reasons for the necessary implementations of the Saturn presentation. Sutariya mentioned the direct cost drivers in the fabrication of Lead Free Boards (high-temp laminates and final finishes) before asserting that the move to Pb-free had created a host of indirect cost drivers as well, which include pre-baking, storage & handling, and an increased scrap rate due to delamination and solderability.
IPC 4101/99/124
The presentation was broken into two sections. The first dealt with Capable Laminates for Lead Free Assembly corresponding to IPC 4101/99 and /124. Sutariya presented numerous effects of the current state of the common callouts. Suppliers lock customers into laminate brand names, and typically phenolic materials that have a moisture absorption up to .45% on 0.028” core; less mechanical strength (interlaminate adhesion); more prone to delamination during assembly; inclination to pad catering on BGA applications. Finally, there were the non-Pb Free capable materials such as FR4. Designers are commonly calling out FR-4 laminates with high Tg values, but without including appropriate Td callouts (time to decomposition at temperature). While FR4 is RoHS Compliant, it is not always capable and 180° Tg does not guarantee adequate Td.
Proposed Solution
Sutariya proposed mid-grade capable Lead Free laminates compliant to IPC 4101/99 or /124 at 150 Tg min. and 325 Td min. Utilizing this approach would lead to higher copper to laminate peel strength, higher inter-laminate adhesion, as well as lower moisture absorption. Also, a 10-20 percent cost saving on the raw materials was promised as a result of these implementations.
The first part of the presentation ended with a promotion for the new FR406HR that is going to address the delamination during the lead free bare board manufacturing process.
SN100CL – Lead Free HASL
The second section dealt with Pb-Free HASL, specifically SN100CL and the Industry misconceptions associated with the discipline such as the predictions of HASL’s inevitable demise, its solderability issues, and the short duration of its usage.
But Sutariya argued that the lower copper erosion on the PCB surface and in the vias was benefit to PCB reliability. Other benefits included: quick process, long shelf life, lower cost, forgiving in regards to humidity, handling and temperature, and finally, Solder Joint Strength.
According to the HALT Test Results (provided by Tim Murphy of Thomson Lab Services and Glenn Sikorcin of Florida CirTech), Lead-Free HASL, with all different solderpastes pooled together, required the most energy (G-force + thermo-cycling) to break the solder joints. Sutariya concluded that lead free HASL solder joints outperform all other surface finishes, including SnPb HASL.
Drawbacks
But there were drawbacks involved pertaining to its planar, which makes it problematic for extremely fine pitch applications. If you’re interested in Past Solderability Issues with SN100Cl, read HASL and Flow: A Lead-Free Alternative from the February 2008 issue of CircuiTree. Furthermore, the SN100CL requires a Thermal Cycle in addition to thermal cycles in the assembly process.
Finally, there still remains no Industry standard regarding the Thickness Acceptability Criteria for SN100CL. As a result, smaller pads receive thicker solder deposition as a result of a Generic Thickness requirement because it is not proper to have just one solder thickness for all pad geometries. Sutariya said the solution was to segregate the minimum alloy thickness by ranges of pad size. By implementing alloy control, lower copper content of alloy increases solderability and the standard drossing of the solder pot is not enough to keep copper below 0.90%.
Sutariya recommended a ¼ - 1/3 solder pot dump once weekly copper content measurement reaches 0.90%.
Specific Design Set-Up
Then Saturn turned its focus to the Design link in the PCB Supply Chain and addressed the need for a specific design set-up. In addition, adjustments would need to be made to air knife pressure, retract speed, and dwell time. In effect, since the operating window is smaller than the SnPB, it is vital for the top of the Supply Chain to take control of the process!
Saturn and Florida CirTech have been utilizing the SN100Cl for over a year and have had no solderability issues at any customer. He attributed this to the value of the Fab Notes that can specify the use of these coupons or range of solder thickness standards.
Sutariya concluded that by doing this, you’d take control of the process by forcing your supplier to meet these specs.
Conclusion
Saturn Electronics’ Corporation’s Lead Free Cost Reduction presentation concludes that through the implementation of one or both of these proposed solutions, one can save up to 30% on their bare board costs while increasing the performance of their products. Additionally, this makes it much easier to standardize fab notes to removable risk of non-performing products.
Sutariya opened the floor to questions from the crowd and attendees, mostly PCB Designers who had very positive feedbacks regarding the recipe Sutariya and Saturn had just shared with them.
During this past summer, Sutariya gave the same presentation through a webinar. Polling questions included:
Have you experienced delamination during Lead Free Assembly?
46% of attendees answered yes
Have you ever tried and subsequently abandoned SN100CL?
6% said yes
12% said no
82% had never even tried it
What is your primary Lead Free Finish?
38% said RoHS Compliant
31% said Immersion Silver
13% said ENIG
13% said Lead Free HASL
6% answered Immersion Tin
PCB West is for PCB engineers, designers, fabricators and managers and includes a five-day conference of more than 35 technical courses.
Saturn Electronics Corporation is a leading manufacturer of high-reliability, and technologically advanced printed circuit boards. Dedicated to quality since our inception, Saturn delivers steadfast manufacturing that ranges from quick-turning elaborate prototypes to scheduled principal volume-production.
Saturn’s adherence to quality resulted in being the first PCB Manufacturer in North America to achieve TS16949 certification.
To view the archived version of this presentation, please email jim@saturnelectronics.com
Bare Board Manufacturer Shows PCB Designers how to Control the Process
Saturn Electronics Corporation, a Bare Board Manufacturer, took its Lead Free Cost Reduction presentation to Santa Clara, CA for the PCB West 2008 from September 14-18. Yash Sutariya delivered the presentation, which claims that utilizing the right combination of materials, finishes, and solders through the IPC 4101/99/124 and SN100CL – Lead Free HASL can produce notable benefits, such as cutting the costs on lead free boards by up to 30% and increasing PCB reliability at the same time.
A crowd approaching close to 40 listened in as Sutariya advanced what he felt were the main reasons for the necessary implementations of the Saturn presentation. Sutariya mentioned the direct cost drivers in the fabrication of Lead Free Boards (high-temp laminates and final finishes) before asserting that the move to Pb-free had created a host of indirect cost drivers as well, which include pre-baking, storage & handling, and an increased scrap rate due to delamination and solderability.
IPC 4101/99/124
The presentation was broken into two sections. The first dealt with Capable Laminates for Lead Free Assembly corresponding to IPC 4101/99 and /124. Sutariya presented numerous effects of the current state of the common callouts. Suppliers lock customers into laminate brand names, and typically phenolic materials that have a moisture absorption up to .45% on 0.028” core; less mechanical strength (interlaminate adhesion); more prone to delamination during assembly; inclination to pad catering on BGA applications. Finally, there were the non-Pb Free capable materials such as FR4. Designers are commonly calling out FR-4 laminates with high Tg values, but without including appropriate Td callouts (time to decomposition at temperature). While FR4 is RoHS Compliant, it is not always capable and 180° Tg does not guarantee adequate Td.
Proposed Solution
Sutariya proposed mid-grade capable Lead Free laminates compliant to IPC 4101/99 or /124 at 150 Tg min. and 325 Td min. Utilizing this approach would lead to higher copper to laminate peel strength, higher inter-laminate adhesion, as well as lower moisture absorption. Also, a 10-20 percent cost saving on the raw materials was promised as a result of these implementations.
The first part of the presentation ended with a promotion for the new FR406HR that is going to address the delamination during the lead free bare board manufacturing process.
SN100CL – Lead Free HASL
The second section dealt with Pb-Free HASL, specifically SN100CL and the Industry misconceptions associated with the discipline such as the predictions of HASL’s inevitable demise, its solderability issues, and the short duration of its usage.
But Sutariya argued that the lower copper erosion on the PCB surface and in the vias was benefit to PCB reliability. Other benefits included: quick process, long shelf life, lower cost, forgiving in regards to humidity, handling and temperature, and finally, Solder Joint Strength.
According to the HALT Test Results (provided by Tim Murphy of Thomson Lab Services and Glenn Sikorcin of Florida CirTech), Lead-Free HASL, with all different solderpastes pooled together, required the most energy (G-force + thermo-cycling) to break the solder joints. Sutariya concluded that lead free HASL solder joints outperform all other surface finishes, including SnPb HASL.
Drawbacks
But there were drawbacks involved pertaining to its planar, which makes it problematic for extremely fine pitch applications. If you’re interested in Past Solderability Issues with SN100Cl, read HASL and Flow: A Lead-Free Alternative from the February 2008 issue of CircuiTree. Furthermore, the SN100CL requires a Thermal Cycle in addition to thermal cycles in the assembly process.
Finally, there still remains no Industry standard regarding the Thickness Acceptability Criteria for SN100CL. As a result, smaller pads receive thicker solder deposition as a result of a Generic Thickness requirement because it is not proper to have just one solder thickness for all pad geometries. Sutariya said the solution was to segregate the minimum alloy thickness by ranges of pad size. By implementing alloy control, lower copper content of alloy increases solderability and the standard drossing of the solder pot is not enough to keep copper below 0.90%.
Sutariya recommended a ¼ - 1/3 solder pot dump once weekly copper content measurement reaches 0.90%.
Specific Design Set-Up
Then Saturn turned its focus to the Design link in the PCB Supply Chain and addressed the need for a specific design set-up. In addition, adjustments would need to be made to air knife pressure, retract speed, and dwell time. In effect, since the operating window is smaller than the SnPB, it is vital for the top of the Supply Chain to take control of the process!
Saturn and Florida CirTech have been utilizing the SN100Cl for over a year and have had no solderability issues at any customer. He attributed this to the value of the Fab Notes that can specify the use of these coupons or range of solder thickness standards.
Sutariya concluded that by doing this, you’d take control of the process by forcing your supplier to meet these specs.
Conclusion
Saturn Electronics’ Corporation’s Lead Free Cost Reduction presentation concludes that through the implementation of one or both of these proposed solutions, one can save up to 30% on their bare board costs while increasing the performance of their products. Additionally, this makes it much easier to standardize fab notes to removable risk of non-performing products.
Sutariya opened the floor to questions from the crowd and attendees, mostly PCB Designers who had very positive feedbacks regarding the recipe Sutariya and Saturn had just shared with them.
During this past summer, Sutariya gave the same presentation through a webinar. Polling questions included:
Have you experienced delamination during Lead Free Assembly?
46% of attendees answered yes
Have you ever tried and subsequently abandoned SN100CL?
6% said yes
12% said no
82% had never even tried it
What is your primary Lead Free Finish?
38% said RoHS Compliant
31% said Immersion Silver
13% said ENIG
13% said Lead Free HASL
6% answered Immersion Tin
PCB West is for PCB engineers, designers, fabricators and managers and includes a five-day conference of more than 35 technical courses.
Saturn Electronics Corporation is a leading manufacturer of high-reliability, and technologically advanced printed circuit boards. Dedicated to quality since our inception, Saturn delivers steadfast manufacturing that ranges from quick-turning elaborate prototypes to scheduled principal volume-production.
Saturn’s adherence to quality resulted in being the first PCB Manufacturer in North America to achieve TS16949 certification.
To view the archived version of this presentation, please email jim@saturnelectronics.com
Thursday, October 23, 2008
Improving Fabrication Yields by Design
Improving Fabrication Yields by Design
Written by Zulki Khan
The PCB designer is the architect for improved PCB yields.
A major requirement in improving board fabrication yields is doing it right the first time, because once the PCB fabrication process is complete there is really no way to go back to fix major mistakes. In some cases you can mitigate design issues during the PCB assembly process, but during PCB fabrication, once layers are laminated and the holes are drilled, you cannot easily undo the process to make corrections.
Therefore, to improve fabrication yields during and after design layout, it’s critical to follow the detailed fabrication notes and drawings, specifically calling out every item that requires any kind of explanation. This includes stack up data, layer construction information, material call outs, as well as drill charts specifying hole counts and symbols, whether drill holes are plated, and any similar information.
Notes and drawings must not have sketchy or ambiguous information, nor should they lead the PCB fabricator to make “guesstimates” about some of the directions. Fabrication notes and drawings must have clear-cut and precise information in their instructions – assumptions are not allowed. If questions arise, the OEM customer should be consulted, and the OEM should resolve any uncertainties.
A good rule of thumb is to engage the fabrication house during PCB layout/design stage. After the designer creates the stack up for impedance control, it’s a good idea to get it verified before the files are released to the fab house. Conversely, the fab house can play a reciprocal role by providing the designer with recommendations and suggestions for boosting yields. For example, a fab house may recommend material changes for a specific application that are better suited to increasing yields than those a designer specifies.
Also, it is a good idea to check the capabilities of a fabrication house before releasing a job to them. If the PCB design calls out for 3 mil lines and spaces, and the fab house does not have the capability to generate this type of feature, they can inadvertently over or under etch traces, causing open or shorts resulting in yield issues. Therefore, working together, the designer and fab house engineer can resolve any question, issue, or ambiguity that arises at an early stage in the design process, before the design ever reaches the fabrication floor.
The Importance of Fabrication Drawing
The PCB designer is the lynchpin for improving fabrication yields from the start. The fabrication drawing – the result of the PCB layout/design – is the tool they rely on to achieve this objective. A seasoned designer always finishes their layout by providing a complete fabrication drawing. An efficient fabrication drawing has four components – notes, mechanical dimensions/drawings, stack up callouts, and a drill chart seen in Figure 1.
Fabrication notes include a wide range of technical details and instructions. The more complete and accurate they are, the more likely that the fabrication house will be able to produce the PCBs with requisite high yields. The following are some of the critical areas that should be covered in fab notes.
http://saturnelectronics.com/fabnotes.htm
http://saturnelectronics.com/minimumguides.htm
It is important to list the IPC class (I, II, or III) on the fabrication notes. Also, the designer should specify the required board materials and surface finishes such as HASL (lead-free or tin-lead type), electroless nickel and immersion gold (ENIG), immersion silver or tin. If it’s gold, what is the quantity and type? A typical soldering applications might call for 3 to 5 microinches of gold over 150 to 200 microinches of nickel. A higher thickness and different type of gold would be needed for specialized applications such as wire bonding. The designer should also include, whenever possible, a note designating a secondary (equivalent) material and manufacturer name if the primary choice is not available at the fabrication house. It may take a week or more to acquire material, causing OEM product delivery delays. That’s the level of detail the designer must include in their notes.
Ensuring that automated optical inspection (AOI) is used is another critical step in board fabrication. AOI checks inner layers to ensure there are no opens or shorts on the board, and that layer-to-layer registration is properly aligned. For example, a note to a fabricator can simply state: “Please make sure Layers 2, 3, 5, and 6 are AOI verified before laminating the layers.”
Solder mask information must also be covered, including if a solder mask is required on one or both sides of the board, halogen content considerations and also designating the color of the solder mask. In addition, it is always a good idea for the designer to mention a few preferred solder mask manufacturers. Fabrication notes must also detail maximum warpage per square inch that the designer will allow, and this should be in accordance with IPC guidelines.
The designer also should include a note on the thieving process that allows for even copper distribution on the board. Thieving adds non-conductive copper material to the board that balances copper weight on the board’s entire surface, so that when etching is performed, it is uniform over the board’s surface. This minimizes the creation of either opens or shorts. Figure 2 shows a PCB design with copper thieving added.
Designing For Odd-Shaped Boards
When it comes to fabrication notes, mechanical dimensions and drawings require equal attention from the designer. This is especially true for odd sized or unusually shaped boards that use radial angles to define curvatures or slot dimensions. When creating a fabrication drawing for such boards, the designer must specify even the smallest detail in lengths, widths, and angles. The designer must carefully designate any holes that reference each other, especially if they are at a specific angle or run concurrent to each other.
Gold fingers, like cables and chassis wires, are used to connect daughter cards to a motherboard or other subsystems, and when providing details on the beveling of the gold fingers at the edge of the connectors, the designer should specify the angle and at what levels the gold fingers should be beveled (see Figure 3).
The datum point 0,0 must be specified, so that every other dimension is measured from that original point. Cutouts, slots, and holes must also be meticulously designated. On the drawing, there are two sides for reference designators. At times, the designer might note a special feature on the bottom side that isn’t required on the top side. This distinction must be made in the fabrication drawing. If not, the fabrication house is left to make what perhaps can be a faulty assumption. Other details the designer must include would be any special features, like counter sink holes or sequential lamination.
Stack up callouts specify board thickness, composition of internal layers, pre-preg thickness, and copper ounces per square inch used on the board. At the layout stage, the designer should perform precise calculations on the amount of current that will flow through the board. The callout specifies the thickness of copper (measured in ounces) to comply with current requirements. What must be avoided is the fabrication house relying on their own judgment, or making a decision using no calculations at all. (Note: an “inaccurate judgment” is not the fault of the fabricator, it’s a design error.)
When calling out for impedance control requirements, a precise tolerance, such as 5% or 10% should be specified. For high-speed designs, impedance requirements could be single ended, or multiple differential impedances. Since there are many factors that can change the impedance on a board, a seasoned designer is always aware and mindful of these factors, which may include the stack up of the board, number of ground planes, trace width and thickness and the dielectric constant.
Lastly, the drill chart covers four aspects – the symbols used, the size of the tools, the quantity of each drill size, and if holes are plated or non-plated. When defining drill symbols to distinguish multiple drill sizes used on the board, a separate precisely defined symbol should be used to make this distinction clear and without ambiguity.
Accurate and comprehensive attention to detail should result in as near an ideal fabrication drawing as possible. A drawing of this caliber eliminates most or all of the uncertainty in the planning and computer-aided manufacturing (CAM) stages, as well as many that may be raised by the fabrication house.
The CAM stage allows the fabrication house to review the different files generated in the PCB layout process. This includes Gerber files, which generates renderings that show layers, power and ground planes, drill holes, etc. At this point, oversights and potential problems can be corrected, as the efficient use of a sophisticated CAM tool will uncover discrepancies, such as half moons, stubs, or missing connections.
Assumptions and Common Sense
Wrong assumptions can cover many aspects of the PCB fabrication process that may include surface finishes, board material, copper plating, and other smaller details such as plated-through holes (PTH) versus non-plated through holes. In the case of the PTH, it can create a short between the chassis and screw tightening the board, if specified incorrectly. At times, surface finish may not be specified by the OEM customer, and an assumption may be made to apply a HASL surface finish, but in a lead-free application, a silver or gold finish might be required to withstand the high thermal profile during reflow.
Improving fabrication yields requires the designer to use plain old common sense, as well as applying their extensive experience and know-how. A seasoned designer knows precisely where the pitfalls exist in a board design, and applies all the tricks and techniques they have learned from previous experience. A considerable amount of that design knowledge results from practical hands-on experience, rather than from textbooks or formal training. PCD&F
Zulki Khan is president and founder, Nexlogic Technologies and can be reached at zk@nexlogic.com.
http://saturnelectronics.com/fabnotes.htm
http://saturnelectronics.com/minimumguides.htm
Written by Zulki Khan
The PCB designer is the architect for improved PCB yields.
A major requirement in improving board fabrication yields is doing it right the first time, because once the PCB fabrication process is complete there is really no way to go back to fix major mistakes. In some cases you can mitigate design issues during the PCB assembly process, but during PCB fabrication, once layers are laminated and the holes are drilled, you cannot easily undo the process to make corrections.
Therefore, to improve fabrication yields during and after design layout, it’s critical to follow the detailed fabrication notes and drawings, specifically calling out every item that requires any kind of explanation. This includes stack up data, layer construction information, material call outs, as well as drill charts specifying hole counts and symbols, whether drill holes are plated, and any similar information.
Notes and drawings must not have sketchy or ambiguous information, nor should they lead the PCB fabricator to make “guesstimates” about some of the directions. Fabrication notes and drawings must have clear-cut and precise information in their instructions – assumptions are not allowed. If questions arise, the OEM customer should be consulted, and the OEM should resolve any uncertainties.
A good rule of thumb is to engage the fabrication house during PCB layout/design stage. After the designer creates the stack up for impedance control, it’s a good idea to get it verified before the files are released to the fab house. Conversely, the fab house can play a reciprocal role by providing the designer with recommendations and suggestions for boosting yields. For example, a fab house may recommend material changes for a specific application that are better suited to increasing yields than those a designer specifies.
Also, it is a good idea to check the capabilities of a fabrication house before releasing a job to them. If the PCB design calls out for 3 mil lines and spaces, and the fab house does not have the capability to generate this type of feature, they can inadvertently over or under etch traces, causing open or shorts resulting in yield issues. Therefore, working together, the designer and fab house engineer can resolve any question, issue, or ambiguity that arises at an early stage in the design process, before the design ever reaches the fabrication floor.
The Importance of Fabrication Drawing
The PCB designer is the lynchpin for improving fabrication yields from the start. The fabrication drawing – the result of the PCB layout/design – is the tool they rely on to achieve this objective. A seasoned designer always finishes their layout by providing a complete fabrication drawing. An efficient fabrication drawing has four components – notes, mechanical dimensions/drawings, stack up callouts, and a drill chart seen in Figure 1.
Fabrication notes include a wide range of technical details and instructions. The more complete and accurate they are, the more likely that the fabrication house will be able to produce the PCBs with requisite high yields. The following are some of the critical areas that should be covered in fab notes.
http://saturnelectronics.com/fabnotes.htm
http://saturnelectronics.com/minimumguides.htm
It is important to list the IPC class (I, II, or III) on the fabrication notes. Also, the designer should specify the required board materials and surface finishes such as HASL (lead-free or tin-lead type), electroless nickel and immersion gold (ENIG), immersion silver or tin. If it’s gold, what is the quantity and type? A typical soldering applications might call for 3 to 5 microinches of gold over 150 to 200 microinches of nickel. A higher thickness and different type of gold would be needed for specialized applications such as wire bonding. The designer should also include, whenever possible, a note designating a secondary (equivalent) material and manufacturer name if the primary choice is not available at the fabrication house. It may take a week or more to acquire material, causing OEM product delivery delays. That’s the level of detail the designer must include in their notes.
Ensuring that automated optical inspection (AOI) is used is another critical step in board fabrication. AOI checks inner layers to ensure there are no opens or shorts on the board, and that layer-to-layer registration is properly aligned. For example, a note to a fabricator can simply state: “Please make sure Layers 2, 3, 5, and 6 are AOI verified before laminating the layers.”
Solder mask information must also be covered, including if a solder mask is required on one or both sides of the board, halogen content considerations and also designating the color of the solder mask. In addition, it is always a good idea for the designer to mention a few preferred solder mask manufacturers. Fabrication notes must also detail maximum warpage per square inch that the designer will allow, and this should be in accordance with IPC guidelines.
The designer also should include a note on the thieving process that allows for even copper distribution on the board. Thieving adds non-conductive copper material to the board that balances copper weight on the board’s entire surface, so that when etching is performed, it is uniform over the board’s surface. This minimizes the creation of either opens or shorts. Figure 2 shows a PCB design with copper thieving added.
Designing For Odd-Shaped Boards
When it comes to fabrication notes, mechanical dimensions and drawings require equal attention from the designer. This is especially true for odd sized or unusually shaped boards that use radial angles to define curvatures or slot dimensions. When creating a fabrication drawing for such boards, the designer must specify even the smallest detail in lengths, widths, and angles. The designer must carefully designate any holes that reference each other, especially if they are at a specific angle or run concurrent to each other.
Gold fingers, like cables and chassis wires, are used to connect daughter cards to a motherboard or other subsystems, and when providing details on the beveling of the gold fingers at the edge of the connectors, the designer should specify the angle and at what levels the gold fingers should be beveled (see Figure 3).
The datum point 0,0 must be specified, so that every other dimension is measured from that original point. Cutouts, slots, and holes must also be meticulously designated. On the drawing, there are two sides for reference designators. At times, the designer might note a special feature on the bottom side that isn’t required on the top side. This distinction must be made in the fabrication drawing. If not, the fabrication house is left to make what perhaps can be a faulty assumption. Other details the designer must include would be any special features, like counter sink holes or sequential lamination.
Stack up callouts specify board thickness, composition of internal layers, pre-preg thickness, and copper ounces per square inch used on the board. At the layout stage, the designer should perform precise calculations on the amount of current that will flow through the board. The callout specifies the thickness of copper (measured in ounces) to comply with current requirements. What must be avoided is the fabrication house relying on their own judgment, or making a decision using no calculations at all. (Note: an “inaccurate judgment” is not the fault of the fabricator, it’s a design error.)
When calling out for impedance control requirements, a precise tolerance, such as 5% or 10% should be specified. For high-speed designs, impedance requirements could be single ended, or multiple differential impedances. Since there are many factors that can change the impedance on a board, a seasoned designer is always aware and mindful of these factors, which may include the stack up of the board, number of ground planes, trace width and thickness and the dielectric constant.
Lastly, the drill chart covers four aspects – the symbols used, the size of the tools, the quantity of each drill size, and if holes are plated or non-plated. When defining drill symbols to distinguish multiple drill sizes used on the board, a separate precisely defined symbol should be used to make this distinction clear and without ambiguity.
Accurate and comprehensive attention to detail should result in as near an ideal fabrication drawing as possible. A drawing of this caliber eliminates most or all of the uncertainty in the planning and computer-aided manufacturing (CAM) stages, as well as many that may be raised by the fabrication house.
The CAM stage allows the fabrication house to review the different files generated in the PCB layout process. This includes Gerber files, which generates renderings that show layers, power and ground planes, drill holes, etc. At this point, oversights and potential problems can be corrected, as the efficient use of a sophisticated CAM tool will uncover discrepancies, such as half moons, stubs, or missing connections.
Assumptions and Common Sense
Wrong assumptions can cover many aspects of the PCB fabrication process that may include surface finishes, board material, copper plating, and other smaller details such as plated-through holes (PTH) versus non-plated through holes. In the case of the PTH, it can create a short between the chassis and screw tightening the board, if specified incorrectly. At times, surface finish may not be specified by the OEM customer, and an assumption may be made to apply a HASL surface finish, but in a lead-free application, a silver or gold finish might be required to withstand the high thermal profile during reflow.
Improving fabrication yields requires the designer to use plain old common sense, as well as applying their extensive experience and know-how. A seasoned designer knows precisely where the pitfalls exist in a board design, and applies all the tricks and techniques they have learned from previous experience. A considerable amount of that design knowledge results from practical hands-on experience, rather than from textbooks or formal training. PCD&F
Zulki Khan is president and founder, Nexlogic Technologies and can be reached at zk@nexlogic.com.
http://saturnelectronics.com/fabnotes.htm
http://saturnelectronics.com/minimumguides.htm
Friday, October 17, 2008
Saturn Electronics and Isola Group to Exhibit at SAE Convergence
Automotive PCB Designers are eagerly anticipating the unique opportunity to consult with top Industry Professionals from the Isola Group. Isola Representatives will be offering Technical Support for Designers and Engineers regarding cost, quality and design performance regarding their new line of laminates. Saturn and Isola will be in Booth 328 at the SAE Convergence taking place in Detroit.
Saturn Electronics Corp. and Isola Laminates collobarated last summer, along with Florida CirTech, on a Lead Free Cost Reductions webinar.
http://circuitsassembly.com/cms/content/view/6821/95/
Pb-Free PCBs
View technorati.com
Saturn Electronics Corp. and Isola Laminates collobarated last summer, along with Florida CirTech, on a Lead Free Cost Reductions webinar.
http://circuitsassembly.com/cms/content/view/6821/95/
Pb-Free PCBs
View technorati.com
Lead Free Cost Reduction Collaborators Saturn Electronics Corp., Isola Laminates, and Florida CirTech Set to Appear at Trade Shows
Lead Free Cost Reduction Collaborators Saturn Electronics Corp., Isola Laminates, and Florida CirTech to Exhibit at SAE Convergence and Mexitronica
The key players in last summer’s Lead Free Cost Reduction webinar will be exhibiting across North America next week as Saturn Electronics and Isola will be exhibiting together at the SAE Convergence and Saturn Electronics and Florida CirTech will both be down in Mexico for this year’s Mexitronica.
Automotive PCB Designers are eagerly anticipating the unique opportunity to consult with top Industry Professionals from the Isola Group. Isola Representatives will be offering Technical Support for Designers and Engineers regarding cost, quality and design performance regarding their new line of laminates. Saturn and Isola will be in Booth 328 at the SAE Convergence taking place in Detroit.
Florida CirTech will be exhibiting SN100CL, a solution for the lead-free HASL process that wets quickly and offers low copper erosion, at the Mexitronica show in Guadalajara. Saturn Electronics Corp. will be in Booth 818. Florida CirTech will be with Nihon Superior in Booth 402.
http://www.saturnelectronics.com/
http://www.isolagroup.com/
http://www.fctassembly.com/
saturn electronics corporation, bare board fabricator, isola group, florida cirtech
The key players in last summer’s Lead Free Cost Reduction webinar will be exhibiting across North America next week as Saturn Electronics and Isola will be exhibiting together at the SAE Convergence and Saturn Electronics and Florida CirTech will both be down in Mexico for this year’s Mexitronica.
Automotive PCB Designers are eagerly anticipating the unique opportunity to consult with top Industry Professionals from the Isola Group. Isola Representatives will be offering Technical Support for Designers and Engineers regarding cost, quality and design performance regarding their new line of laminates. Saturn and Isola will be in Booth 328 at the SAE Convergence taking place in Detroit.
Florida CirTech will be exhibiting SN100CL, a solution for the lead-free HASL process that wets quickly and offers low copper erosion, at the Mexitronica show in Guadalajara. Saturn Electronics Corp. will be in Booth 818. Florida CirTech will be with Nihon Superior in Booth 402.
http://www.saturnelectronics.com/
http://www.isolagroup.com/
http://www.fctassembly.com/
saturn electronics corporation, bare board fabricator, isola group, florida cirtech
Wednesday, September 10, 2008
UofM Solar Car Team Wins National Championship
Hail to the Victors
Wolverines North American Solar Challenge Champs
The University of Michigan Solar Car Team took this years North American Solar Challenge and Saturn Electronics Corporation, PCB Manufacturing firm located in Romulus, Mi, was proud to supply the bare boards for the Michigan Solar Car team as they geared up for the 2008 showdown.
As the University of Michigan Solar Car Team fervently primed for the 2008 North American Solar Challenge, Saturn Electronics Corporation was proud to be a co-sponsor for the 2008 University of Michigan Solar Car Team. The race was a 10-day, 2500 mile trek starting in the American Southwest and ending on the other side of the Canadian border.
About the Challenge
The 2008 North American Solar Challenge (NASC2008) is a competition to design, build, and drive solar-powered cars in a cross-country time/distance rally event. Teams compete in a 2400 mile drive from Dallas, Texas to Calgary, Alberta.
Saturn’s Obligation
In March 2008, Saturn VP (and UofM Grad) Yash Sutariya contacted his alma mater to inquire if Saturn could be of assistance to the solar car team. The team's vehicle, Continuum, had been involved in a crash on the first day of racing in the 2007 WSC in Australia and would have to be rebuilt from the ground up. The resilient young team buoyantly took the task of redesigning the entire car. Sutariya encouraged them to send over the most advanced boards for quick-turns.
Sutariya told the team, which was founded in 1989 and has won four national championships, to send over as many gerber files as necessary and to make them as nasty as necessary and not to worry about anything but winning.
“I was proud to contribute our services to this motivated fraternity of Wolverines,” said Sutariya. "We had worked with the team in the past, and when I spoke to them about what they needed, I resolved to help them in every capacity Saturn has at its disposal.”
Continuum is the ninth solar car the team has built since its inception.
For more information on the team, click here: University of Michigan Solar Car Team
For more information on the race, click here: 2008 North American Solar Car Challenge
About Saturn Electronics Corporation, Printed Circuit Board Manufacturing Firm (MBE)
Saturn Electronics Corporation, Bare Printed Circuit Board Manufacturer is a Minority Owned Business Enterprise located in Romulus, Mi. As a leading manufacturer of high-reliability and technologically advanced bare Printed Circuit Boards, such as Thermal Management for Heavy Copper PCBs, Saturn is an industry leader in the latest technological research as evident in last summer's Lead Free Cost Reduction Webinar.
PCB Manufacturing Capabilites
Dedicated to quality since our inception, Saturn delivers steadfast manufacturing with PWB Capabilties that range from quick-turning elaborate PCB prototypes to scheduled principal volume-production while maintaining a flexible capacity for Printed Circuit Board production.
Bare Board Quality
Saturn’s adherence to circuit board quality resulted in being the first Bare Printed Circuit Board Manufacturer in North America to achieve TS16949 certification. Saturn’s obligation to fiscal prudence makes it a debt-free, financially strong Corporation allocating profit for expansion, improved capabilities, and reduced cost.
SN100CL
In addition, Saturn's industry setting criteria for the SN100CL process has been a valued asset to both customers and competitors alike. Saturn offers a free SN100CL Minimum Thickness Guidelines coupon in its RoHS Lead Free Resource Center.
Providing solutions while lowering costs is the reason Saturn can meet all your Printed Circuit Board needs.
For more information about Saturn Electronics Corporation, Bare Printed Circuit Board Manufacturing firm, click here: Saturn Electronics Corporation
Wolverines North American Solar Challenge Champs
The University of Michigan Solar Car Team took this years North American Solar Challenge and Saturn Electronics Corporation, PCB Manufacturing firm located in Romulus, Mi, was proud to supply the bare boards for the Michigan Solar Car team as they geared up for the 2008 showdown.
As the University of Michigan Solar Car Team fervently primed for the 2008 North American Solar Challenge, Saturn Electronics Corporation was proud to be a co-sponsor for the 2008 University of Michigan Solar Car Team. The race was a 10-day, 2500 mile trek starting in the American Southwest and ending on the other side of the Canadian border.
About the Challenge
The 2008 North American Solar Challenge (NASC2008) is a competition to design, build, and drive solar-powered cars in a cross-country time/distance rally event. Teams compete in a 2400 mile drive from Dallas, Texas to Calgary, Alberta.
Saturn’s Obligation
In March 2008, Saturn VP (and UofM Grad) Yash Sutariya contacted his alma mater to inquire if Saturn could be of assistance to the solar car team. The team's vehicle, Continuum, had been involved in a crash on the first day of racing in the 2007 WSC in Australia and would have to be rebuilt from the ground up. The resilient young team buoyantly took the task of redesigning the entire car. Sutariya encouraged them to send over the most advanced boards for quick-turns.
Sutariya told the team, which was founded in 1989 and has won four national championships, to send over as many gerber files as necessary and to make them as nasty as necessary and not to worry about anything but winning.
“I was proud to contribute our services to this motivated fraternity of Wolverines,” said Sutariya. "We had worked with the team in the past, and when I spoke to them about what they needed, I resolved to help them in every capacity Saturn has at its disposal.”
Continuum is the ninth solar car the team has built since its inception.
For more information on the team, click here: University of Michigan Solar Car Team
For more information on the race, click here: 2008 North American Solar Car Challenge
About Saturn Electronics Corporation, Printed Circuit Board Manufacturing Firm (MBE)
Saturn Electronics Corporation, Bare Printed Circuit Board Manufacturer is a Minority Owned Business Enterprise located in Romulus, Mi. As a leading manufacturer of high-reliability and technologically advanced bare Printed Circuit Boards, such as Thermal Management for Heavy Copper PCBs, Saturn is an industry leader in the latest technological research as evident in last summer's Lead Free Cost Reduction Webinar.
PCB Manufacturing Capabilites
Dedicated to quality since our inception, Saturn delivers steadfast manufacturing with PWB Capabilties that range from quick-turning elaborate PCB prototypes to scheduled principal volume-production while maintaining a flexible capacity for Printed Circuit Board production.
Bare Board Quality
Saturn’s adherence to circuit board quality resulted in being the first Bare Printed Circuit Board Manufacturer in North America to achieve TS16949 certification. Saturn’s obligation to fiscal prudence makes it a debt-free, financially strong Corporation allocating profit for expansion, improved capabilities, and reduced cost.
SN100CL
In addition, Saturn's industry setting criteria for the SN100CL process has been a valued asset to both customers and competitors alike. Saturn offers a free SN100CL Minimum Thickness Guidelines coupon in its RoHS Lead Free Resource Center.
Providing solutions while lowering costs is the reason Saturn can meet all your Printed Circuit Board needs.
For more information about Saturn Electronics Corporation, Bare Printed Circuit Board Manufacturing firm, click here: Saturn Electronics Corporation
Saturn Electronics Corp. to Present at PCB West
Saturn Electronics Corp. to Present at PCB West
PCB Fabricator to Take Industry-Leading Lead Free Knowledge on the Road
Romulus, MI – June 18, 2008 – SATURN ELECTRONICS CORP. will be presenting their Lead Free Cost Reduction seminar at the PCB West 2008 in Santa Clara, CA this September.
About the Seminar
The purpose of the presentation is to educate the electronic products community (purchasing, engineering, and operations) on the latest product information. Not only will the PCB Fabricator demonstrate--via lab and practical testing--how to reduce cost, but also (and more importantly), how to ensure higher levels of quality and reliability pertaining to Lead Free bare printed circuit boards.
These necessary implementations are two-fold and Saturn has worked in conjunction with their respective suppliers at each-and-every isolated step of the controlled process to include the industry criteria they helped set pertaining to SN100CL.
About the Speaker
Yash Sutariya received his BBA from the University of Michigan School of Business Administration. After graduation he worked in Valuation and Bankruptcy/Turnaround Consulting.
He is currently a member of Saturn Electronics Corporation’s senior management team. Since joining this team, Saturn has successfully navigated from a low-mix, high volume, automotive supplier to a high-mix, medium-to-high volume diversified supplier. As a result of the company’s transformation, manufacturing capabilities now range from quick-turn prototypes to scheduled volume production while attending a broad cross-section of industries to include: industrial controls, telecommunications, aerospace, and power supply industries.
For more information on the PCB West 2008, please click on the link:
www.pcbwest.com
www.saturnelectronics.com
PCB Fabricator to Take Industry-Leading Lead Free Knowledge on the Road
Romulus, MI – June 18, 2008 – SATURN ELECTRONICS CORP. will be presenting their Lead Free Cost Reduction seminar at the PCB West 2008 in Santa Clara, CA this September.
About the Seminar
The purpose of the presentation is to educate the electronic products community (purchasing, engineering, and operations) on the latest product information. Not only will the PCB Fabricator demonstrate--via lab and practical testing--how to reduce cost, but also (and more importantly), how to ensure higher levels of quality and reliability pertaining to Lead Free bare printed circuit boards.
These necessary implementations are two-fold and Saturn has worked in conjunction with their respective suppliers at each-and-every isolated step of the controlled process to include the industry criteria they helped set pertaining to SN100CL.
About the Speaker
Yash Sutariya received his BBA from the University of Michigan School of Business Administration. After graduation he worked in Valuation and Bankruptcy/Turnaround Consulting.
He is currently a member of Saturn Electronics Corporation’s senior management team. Since joining this team, Saturn has successfully navigated from a low-mix, high volume, automotive supplier to a high-mix, medium-to-high volume diversified supplier. As a result of the company’s transformation, manufacturing capabilities now range from quick-turn prototypes to scheduled volume production while attending a broad cross-section of industries to include: industrial controls, telecommunications, aerospace, and power supply industries.
For more information on the PCB West 2008, please click on the link:
www.pcbwest.com
www.saturnelectronics.com
Saturn Electronics Corporation to attend AmCon Grand Rapids
Visit Saturn during the AmCon Grand Rapids Show at booth 239
Romulus, MI--Saturn Electronics Corporation will be present at the AmCon Grand Rapids show in Michigan September 17-18. Check out their booth for more information about high volume, lead free (SN100CL) and prototype printed circuit board manufacturing.
Click here to read more
www.saturnelectronics.com
Romulus, MI--Saturn Electronics Corporation will be present at the AmCon Grand Rapids show in Michigan September 17-18. Check out their booth for more information about high volume, lead free (SN100CL) and prototype printed circuit board manufacturing.
Click here to read more
www.saturnelectronics.com
SN100CL Minimum Thickness Guidelines
Saturn Electronics Corporation Suggested PWB Fabrication Notes
SN100CL Minimum Thickness Guidelines
Currently, there are no set requirements for minimum lead free solder finish requirements. Many companies who have run this solder coating process in the tin-lead version know that thickness varies dramatically based on pad size. Furthermore, minimum coating thickness is more critical to the solderability of SN100CL more than it is to standard tin-lead finish. Combining these two facts, it is all the more important to create a new standard by pad area.
SN100CL Minimum Thickness Guidelines
Currently, there are no set requirements for minimum lead free solder finish requirements. Many companies who have run this solder coating process in the tin-lead version know that thickness varies dramatically based on pad size. Furthermore, minimum coating thickness is more critical to the solderability of SN100CL more than it is to standard tin-lead finish. Combining these two facts, it is all the more important to create a new standard by pad area.
Pb-Free Minimum Thickness Coupon
After studying literally thousands of panels and the subsequent solderability results, Saturn Electronics Corporation has established a coupon and general guidelines for this finish. Having this coupon on the actual board / array removes the variation in acceptability measurements between the supplier and the customer by standardizing not only the location of the measurement, but also the thickness by applicable pad geometry.
Also, customers can request a gerber format of this coupon to insert into the waste area of their PCB boards. Additionally, Saturn will send the suggested minimum thickness requirements resulting from the study.
For more information on Saturn's Lead-Free HASL and Laminates for PCBs visit the SN100CL Minimum Thickness Guidelines page as well as the IPC Lead Free Material Specification Sheets in the Suggested Fab Notes section of our RoHS / Lead Free Resource Center.
If you have any further inquiries, contact Saturn Electronics Corporation, Bare Printed Circuit Board Manufacturing firm, to speak with an engineer regarding any further technical matters.
Saturn Electronics Corporation is a Minority Owned Business Enterprise and proud member of the Michigan Minority Business Development Council (MMBDC)
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